Applied^™ Picosun^™ R-200 Advanced

Applied^™ Picosun^™ R-200 Advanced ALD systems are suitable for R&D on dozens of applications such as IC components, MEMS devices, displays, LEDs, lasers, and 3D objects such as lenses, optics, jewelry, coins, and medical implants.

The agile design enables the highest quality ALD film depositions together with the ultimate system flexibility to fit future needs and applications. The hot-wall design with fully separate inlets and instrumentation enables particle-free processing adaptable on a wide range of materials on wafers, 3D objects, and all nanoscale features. Excellent uniformity even on the most challenging through-porous, ultra-high aspect ratio, and nanoparticle samples is achieved thanks to our proprietary Picoflow^™ technology.

Applied^™ Picosun^™ R-200 Advanced systems are equipped with highly functional and easily exchangeable precursor sources for liquid, gaseous, and solid chemicals. Highly efficient and remote plasma option enables deposition of metals without the risk of short-circuiting or plasma damage. Integration with glove boxes, manual and automated loaders, powder chambers, and various in situ analytics systems enable efficient and flexible research with good results no matter what your research area is now or might become later on.

Typical Substrate Size and Type

• 50-200 mm single wafers
• 156 mm x 156 mm solar Si wafers
• 3D objects
• Powders and particles
• Porous, through-porous, and high aspect ratio (up to 1:2500)

Processing Temperature and Capacity

• 50 – 500°C, plasma 450°C (650 °C with heated chuck on request)

Typical Processes

• Al₂O₃, TiO₂, SiO_2, Ta₂O₅, HfO₂, ZnO, ZrO₂, AlN, TiN, metals such as Pt or Ir

Substrate Loading

• Manual loading with a pneumatic lift
• Load lock with magnetic manipulator arm
• Semi-automatic loading with handling robot

Precursors

• Liquid, solid, gas, ozone, plasma
• Up to 12 sources with 6 separate inlets (7 if the plasma option is chosen)

Options

• Picoflow^™ diffusion enhancer