Applied^™ Picosun^™ P-300B

The Applied^™ Picosun^™ P-300B ALD system is specially designed for production of MEMS devices such as print heads, sensors, and microphones, and coating of various 3D items such as mechanical machinery parts, glass or metal sheets, coins, watch parts and jewelry, lenses, optics, and medical devices and implants.

The Picosun^™ P-300 ALD systems have become the new standard in high volume ALD manufacturing. By integrating our hot-wall design with fully separated inlets, we can create the highest quality ALD films with excellent yield, low particle levels, and superior electrical and optical performance. The agile design with easy and fast maintenance ensures minimum system downtime and lowest cost-of-ownership in the market. Our proprietary Picoflow^™ diffusion enhancer technology enables highly conformal coatings on ultra-high aspect ratio substrates with production-proven processes.

The system is fast, highly reliable and extremely easy to maintain.

Typical Substrate Size and Type

• 200 mm wafers in batches of 25 pcs (standard pitch)
• 150 mm wafers in batches of 50 pcs (standard pitch)
• 100 mm wafers in batches of 75 pcs (standard pitch)
• All kinds of 3-dimensional items such as mechanical machinery parts, coins, watch parts and jewelry, lenses, optics, and medical equipment, surgical implants and implantable devices
• High aspect ratio samples (up to 1:2500)

Processing Temperature and Capacity

• 50 – 500°C

Typical Processes

• Batch processes available with cycle times down to single digit seconds
• Al₂O₃, SiO₂, Ta₂O₅, HfO₂, ZnO, TiO₂, ZrO₂, and metals
• Down to <1% 1σ non-uniformity in a batch (Al₂O₃, WIW, WTW, B2B, 49 pts, 5mm EE)

Substrate Loading

• Manual loading with a pneumatic lift
• Industrial robot loading

Precursors

• Liquid, solid, gas, ozone
• Level sensors, cleaning and refill service
• Up to 7 sources with 4 separate inlets